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Samsung Aggressively Aggregating Acronyms As EMCP Assembly Activated
engadget.com 3 weeks, 4 days agoSamsung's started foundries rolling for its new embedded multi-chip package memory for budget smartphones -- after the success of the high-end modules that were released in October. eMCP jams together 30-nanometer low-power DDR2 DRAM and 20-nanometer NAND flash memory into a single slice of silicon. In real terms, this means that there's a 4GB e-MMC (embedded MultiMediaCard) flash chip with a 256MB, 512MB or 768MB DDR2 DRAM module bolted on the side. According to the company, it'll consume 25 percent less p
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Samsung Returns To Long-Term Debt Market
online.wsj.com 4 weeks, 1 day agoSamsung Electronics said it asked bankers to help it raise $1 billion in a bond offering, the first time since 1997 the manufacturer will use long-term debt to pay for expansion.
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